Huawei 3nm chips could debut in 2026. According to a report from Taiwan’s Economic Daily News, Huawei is planning to tape out its 3nm chipsets by 2026.

A report from Taiwanese outlet UDN reveals Huawei’s dual-track approach to 3nm chips, building on its recent success with the 5nm Kirin X90, manufactured by SMIC without ASML’s EUV machines.

However, the advance won’t stop here as Huawei already has plans for the 3nm generation. According to the new report, the 3 nm chips are already in the R&D stage.

Huawei is developing a true 5 nm production line without the need for EUV lithography machines. Furthermore, 3 nm chips are already in the R&D stage, with plans to start production by 2026 ...

Huawei Technologies, a Shenzhen-based telecommunication equipment maker, is reportedly planning to make 3 nanometer chips with deep ultraviolet (DUV Saturday 14 June 2025 11:10 GMT عربي ...

Huawei is reportedly accelerating efforts to develop a 3nm chip, with a possible tape-out expected as early as 2026. Despite mounting pressure from US trade restrictions, the Chinese tech giant ...

Chinese corporation Huawei is reportedly preparing to launch an application processor (AP) based on 3-nanometer (nm) process technology next year. The production is being prepared in cooperation ...

Huawei is working with Semiconductor Manufacturing International Corp (SMIC) on an advanced 3nm chip, with the US sanction-hit tech giant reportedly preparing to send the design to China’s largest ...

Apple, Qualcomm, and MediaTek are reportedly set to launch two nanometer systems-on-a-chip (SOCs) in late 2026, with the new processors potentially manufactured by Taiwan Semiconductor Manufacturing ...

Huawei reenters the ring after 6 years, championing 7nm Mate XT following 3nm iPhone 16 announcement Monica Chen, Hsinchu; Jessie Shen, DIGITIMES Asia Wednesday 11 September 2024 0 Credit: AFP ...