In 1999, Stig Oresjo, then of Agilent Technologies, conducted a major study of solder-joint defects on printed-circuit boards (PCBs). The study, which at the time provided the most definitive data on ...

Catching all defects in chip packaging is becoming more difficult, requiring a mix of electrical tests, metrology screening, and various types of inspection. And the more critical the application for ...

Solder is the conductive metal glue that one uses to stick components together. If you get the component and the PCB hot enough, and melt a little solder in the joint, it will stay put and conduct ...

We might be amidst a chip shortage, but if you enjoy reverse-engineering, there’s never a shortage of intriguing old chips to dig into – and the 2513N 5×7 character ROM is one such chip. Amidst a long ...

Conversely,experienced embedded designers know to mask or tent BGA vias at thedesign and layout level. Even when this step is omitted, adesign-for-manufacture (DFM) check mapped out at the planning ...

It has taken almost a decade for automated optical inspection (AOI) systems to establish their place on PCB production lines. In the same period, the number of AOI vendors and the variety of AOI ...

X-ray and advanced automated techniques combine to create a capable tool for lead-free solder inspection needs. Within two years, solder used in electronics manufactured or sold in Europe must meet ...