TSMC's upcoming CoPoS packaging technology could reduce chip costs while improving AI performance, with mass production reportedly targeted for 2028.

TSMC’s capacity struggles are turning into a boon for Intel. As the Taiwanese chip making giant struggles to meet ...

(Reuters) -Intel on Thursday unveiled key details of its upcoming Panther Lake laptop processor, the first chip built on its next-generation 18A production process, aiming to convince investors its ...

Apple and Intel reportedly reached an early chip manufacturing agreement that could reduce Apple’s TSMC reliance and boost Intel’s foundry ambitions.

Intel Corp. is reportedly engaged in talks with Advanced Micro Devices Inc. over a deal that could see it manufacture some of its rival’s less advanced semiconductors. A report by Semafor on Wednesday ...

Google is reportedly in discussions with South Korean tech giant Samsung Electronics to manufacture a critical portion of its ...

Many cuts pre-date the appointment last year of Lip-Bu Tan as CEO. Now, Tan is placing a long-term bet beyond the current ...

The chip industry is the most complex that you could imagine, and quantum computing, intrinsically, is based on some of the ...

Google is reportedly looking beyond TSMC for future capacity. A new report suggests Samsung could play a key role in building ...

Transistors etched into the latest processor designs now measure just a few nanometers across, placing them well below the ...

India has made steady progress in consolidating earlier investments into a full-stack value chain of its semiconductor ...